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Solder 5 times faster with zero defects
Learn more about LMPA™ on lmpa.interflux.com
Speed: 30 mm/s
SOLDERING FLUXES
for selective soldering
SelectIF 2040
NEW
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Water based flux
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For selective soldering
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Absolutely halide-free
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High deoxidation power
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High temperature resistant
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High compatibility with conformal coating
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Low residue
Interflux® SelectIF 2040 is a water based no-clean selective soldering flux with a wide process window and low residue formation.
Interflux® SelectIF 2040 is a water based no-clean selective soldering flux with a wide process window and low residue formation.
Withstands high process temperatures and long process times.
For SnPb and lead-free processes
OR L0 according to EN and IPC standards
Solid content: 6,5% ±0,2
Halide content: 0,00%
IF 2005C
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Alcohol based
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For selective soldering
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For pre-tinning
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Absolutely halide-free
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High deoxidation power
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Long preheat resistant
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High compatibility with conformal coating
Interflux® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.
Interflux® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.
SnPb and lead-free compatible
Suitable for spray and foam fluxing
OR L0 according to EN and IPC standards
Solid content: 3,3% ± 0,3
Halide content: 0,00%
PacIFic 2009M
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Water based flux
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For wave soldering
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For selective soldering
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For pre-tinning
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For spray fluxing
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Absolutely halide-free
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High compatibility with conformal coating
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Low residue
Interflux® PacIFic 2009M is a water based no-clean flux mainly used for wave and selective soldering.
Interflux® PacIFic
2009M is a water based no-clean flux mainly used for wave and selective soldering.
For SnPb and lead-free processes
OR L0 according to EN and IPC standards
Solid content: 3,7% ±0,15
Halide content: 0,00%
PacIFic 2009MLF
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Water based flux
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For wave soldering
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For selective soldering
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For spray fluxing
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Absolutely halide-free
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Anti solder ball formation
PacIFic 2009MLF is a water based no-clean soldering flux developed to minimize micro solder ball formation.
PacIFic 2009MLF is a water based no-clean soldering flux developed to minimize micro solder ball formation.
For SnPb and lead-free processes
Main field of use: wave soldering and selective soldering
OR L0 according to EN and IPC standards
Solid content: 3,6% ±0,2
Halide content: 0,00%
IF 3006
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Low VOC
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For wave soldering
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For selective soldering
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For pre-tinning
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Absolutely halide-free
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High compatibility with conformal coating
Interflux® IF 3006 is a resin- and rosin free, no-clean soldering flux with a reduced VOC content.
Interflux® IF 3006 is a resin- and rosin free, no-clean soldering flux with a reduced VOC content.
For SnPb and lead-free processes
Also for pre-tinning
OR L0 according to EN and IPC standards
Solid content: 3,2% ±0,4
Halide content: 0,00%
SPRAY FLUXERS
for selective soldering
ICSF Select
NEW
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For wave soldering
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For spray fluxing
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For alcohol based fluxes
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For water based fluxes
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For rosin based fluxes
The Revolutionary Selective Jet Fluxer is designed to control the amount of flux for each solder joint without losing the ability to maintain the required cycle time demanded by wave soldering processes.
The Revolutionary Selective Jet Fluxer is designed to control the amount of flux for each solder joint without losing the ability to maintain the required cycle time demanded by wave soldering processes. The Jet technology used replaces completely the need of spray technology. As a result, the ICSF-Select offers a Total Flux Process control needed for today’s more demanding and complicated soldering requirements, especially lead-free processes.
√ Environmental friendly
√ Up to 95% less flux usage
√ Less maintenance chemicals
√ Longer life of PCB carriers/pallets
√ Tremendous reduction in flux fumes going into the exhaust/environment
√ Solderability Performance
The ability to program points, lines, multi-lines, areas allows the engineer to decide how much flux/pressure is required for certain solder joints up to complete areas. This capability opens up the process window without risking excess of flux residues. Thanks to the XY-movement speed up to 1,500 mm/s, the cycle time will be up to the standard required for wave soldering mass production.
AUXILIARIES
for selective soldering
IF 930
nozzle cleaner
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For selective soldering
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For SnPb(Ag) processes
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For lead-free processes
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Absolutely halide-free
Interflux® IF 930cleans and de-oxidizes wettable nozzles of selective soldering systems.
Interflux® IF 930 cleans and de-oxidizes wettable nozzles of selective soldering systems.
Safe and easy one-step cleaning
Replaces IF 920
ANTI-OXIDANT PELLETS
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For wave soldering
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For selective soldering
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For pre-tinning
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For SnPb(Ag) processes
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For lead-free processes
Interflux® Anti-oxidant pellets minimize the formation of oxides on lead-free and SnPb(Ag) solder baths.
Interflux® Anti-oxidant pellets minimize the formation of oxides on lead-free and SnPb(Ag) solder baths.
Used as an addition in the solder bath
For SnPb(Ag) (blue label) or lead-free (green label) alloys
Anti-oxidant pellets are not recommended under closed inert atmospheres
nor for Ni-doped solder alloys.
SOLDER BARS
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For wave soldering
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For selective soldering
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For pre-tinning
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For dip soldering
Interflux® Solder Bars are made from high purity, low oxidation metals in SnPb(Ag) and lead-free alloys.
Interflux® Solder Bars are made from high purity, low oxidation metals in SnPb(Ag) and lead-free alloys.
PLAIN SOLDER WIRE
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For selective soldering
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For pre-tinning
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For dip soldering
Interflux® plain solder wire for automatic solder feeding on selective soldering systems in lead-free and SnPb(Ag) alloys.
Interflux® plain solder wire for automatic solder feeding on selective soldering systems in lead-free and SnPb(Ag) alloys.
Wire diameter: 2mm/ 3mm
On 4kg/ 1kg spools
4kg spool size: 125mm x 125mm (dia.x length)
SOLDER PELLETS
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For wave soldering
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For selective soldering
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For rework & repair
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For pre-tinning
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For dipping
Interflux® Solder Pellets are small pieces of solder for easy solder bath filling in lead-free and SnPb(Ag) alloys.
Interflux® Solder Pellets are small pieces of solder for easy solder bath filling in lead-free and SnPb(Ag) alloys.
Size: 1cm x 1cm approx.
Can't find the product? For a complete list of products, check our library
CONTACT
INTERFLUX
HEADQUARTERS
INTERFLUX
HEADQUARTERS
Interflux Electronics NV
Gent zeehaven 3170A
Eddastraat 51
9042 Gent
BELGIUM
Tel.: +32 9251 4959
Fax: +32 9251 4970
info@interflux.com
CONTACT
INTERFLUX WORLDWIDE
INTERFLUX WORLDWIDE
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