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Solder 5 times faster with zero defects
Learn more about LMPA™ on lmpa.interflux.com
Speed: 30 mm/s
SOLDER PASTES
for reflow soldering
LMPA™-Q6
NEW
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Enhanced low melting point solder paste
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High stability on the stencil
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Absolutely halide-free
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Smooth, clear and transparent residue
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Low voiding
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Reduced cost of production.
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Increased mechanical reliability
Interflux® LMPA™-Q6 is a no-clean solder paste with the high reliability LMPA™-Q low melting point alloy.
Interflux®
LMPA™-Q6
is a no-clean solder paste with the high reliability LMPA™-Q low melting point alloy.
LMPA™ -Q6 solder paste has improved printing stability, stencil life and more transparent residue compared to DP 5600.
RO L0 to IPC and EN standards.
Halide content 0,00%
DP 5600
POPULAR
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For reflow soldering
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For stencil printing
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For dispensing
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Absolutely halide-free
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Low melting temperature
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Low voiding
Interflux® DP 5600 is a no-clean solder paste for low temperature SnBi(Ag) alloys.
Interflux® DP 5600 is a no-clean solder paste for low temperature SnBi(Ag) alloys.
RO L0 to EN and IPC standards
Halide content: 0,00%
Sn42Bi57Ag1 (melting point 139°C ~ 282°F)
IF 9057
NEW
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High stability on the stencil
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Absolutely halide-free
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For SnPb(Ag) alloys
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For Lead-free alloys
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Transparent post reflow residue
Interflux® IF 9057 is a no-clean solder paste with optimized printing stability and transparent residue after reflow, in lead-free and SnPb(Ag) alloys.
Interflux® IF 9057 is a no-clean solder paste with optimized printing stability and transparent residue after reflow, in lead-free and SnPb(Ag) alloys.
RO L0 to IPC and EN standards.
Halide content 0,00%
DP 5505
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For reflow soldering
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For stencil printing
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For dispensing
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Absolutely halide-free
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Lead-free alloys
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SnPb alloys
Interflux® DP 5505 is our general purpose, high stability, no-clean solder paste in SnPb(Ag) and lead-free alloys.
Interflux® DP 5505 is our general purpose, high stability, no-clean solder paste in SnPb(Ag) and lead-free alloys.
Low voiding
High printing speeds
Suitable for Pin-in-Paste
Reduced head-in-pillow defect
RO L0 to EN and IPC standards
Halide content: 0,00%
µ-dIFe 7
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For reflow soldering
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For rework & repair
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For dipping
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Absolutely halide-free
Interflux® µ-dIFe 7 is a no-clean, lead-free solder paste for dipping applications.
Interflux® µ-dIFe 7 is a no-clean, lead-free solder paste for dipping applications.
Repeatable and selective paste volume
Fast and easy application
Reduced risk of bridging on μ-BGAs
Suitable for the ERSA Dip&Print Station
For Ball Grid Arrays, J-lead and Gull Wing ICs
RO L0 to EN and IPC standards
Halide content: 0,00%
IF 9009LT
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For reflow soldering
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For stencil printing
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For dispensing
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Lead-free alloys
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SnPb alloys
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Increased activity
Interflux® IF 9009LT is a no-clean solder paste with increased activity in SnPb(Ag) and lead-free alloys.
Interflux® IF 9009LT is a no-clean solder paste with increased activity in SnPb(Ag) and lead-free alloys.
For degraded and difficult to solder surfaces
RE L1 to EN and IPC standards
AUXILIARIES
for reflow soldering
Purgel
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For rework & repair
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For dispensing
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Approved for MYDATA MY 500
Interflux® Purgel is a neutral cleaner/conditioner for pumps and valves of dispensing systems.
Interflux® Purgel is a neutral cleaner/conditioner for pumps and valves of dispensing systems.
For preserving dispensing system parts when not in use.
MYDATA MY 500 approved.
IPA/DI WIPES
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ESD-safe
Interflux® pre-saturated IPA/DI wipes in flip-top tubs and refill bags for general cleaning of surfaces.
Interflux® pre-saturated IPA/DI wipes in flip-top tubs and refill bags for general cleaning of surfaces.
lint-free, non woven fabric
single wipe size: 15 x 21cm
100 pcs/ roll
STENCIL CLEAN WIPES
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For stencil cleaning
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Alcohol based
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ESD-safe
Interflux® pre-saturated stencil clean wipes in flip-top tubs and refill bags for the removal of solder paste and non cured SMT adhesive from stencils and tools.
Interflux® pre-saturated stencil clean wipes in flip-top tubs and refill bags for the removal of solder paste and non cured SMT adhesive from stencils and tools.
lint-free, non-woven fabric
single wipe size: 15 x 21cm
100 pcs/ roll
ISC 8020
stencil cleaning fluid
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For stencil printing
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Alcohol-based
Interflux® ISC 8020 is a stencil cleaning fluid for stencil printers.
Interflux® ISC 8020 is a stencil cleaning fluid for stencil printers.
For the removal of solder paste and uncured SMT adhesives.
Can't find the product? For a complete list of products, check our library
CONTACT
INTERFLUX
HEADQUARTERS
INTERFLUX
HEADQUARTERS
Interflux Electronics NV
Gent zeehaven 3170A
Eddastraat 51
9042 Gent
BELGIUM
Tel.: +32 9251 4959
Fax: +32 9251 4970
info@interflux.com
CONTACT
INTERFLUX WORLDWIDE
INTERFLUX WORLDWIDE
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